Nothing Phone (2a) Confirmed to Pack Custom Dimensity 7200 Pro Chipset

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The upcoming Nothing Phone (2a) will be powered by a custom Dimensity 7200 Pro chipset, which Nothing co-developed with MediaTek. This new chip provides an 18% boost in performance over the Snapdragon 778G+ used in the prior Phone (1) model, while also being 16% more power efficient.

Nothing selected the Dimensity 7200 Pro over other options like the Snapdragon 782G and Snapdragon 7 Gen 2. A key factor was MediaTek’s use of TSMC’s advanced second-generation 4nm fabrication process for the 7200 Pro. By comparison, Qualcomm’s competitors rely on the inferior 6nm process.

In terms of CPU configuration, the Dimensity 7200 Pro features an octa-core design with 2 high-performance Cortex-A715 cores clocked at 2.8 GHz and 6 efficient Cortex-A510 cores. An earlier AnTuTu benchmark leak showed an impressive total score of 738,164 points.

ALSO READ: Spoiler Alert! Nothing Phone (2a) Chipset Still a Mystery as Dimensity 7200 Claim Debunked

Beyond raw performance, Nothing also worked closely with MediaTek to optimize integration throughout the SoC…

Nothing Phone (2a) Launch Event Set for March 5th

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