- The Honor Magic V3 will be even thinner than the Magic V2, with a folded thickness between 9mm and 9.98mm.
- It will be powered by the Snapdragon 8 Gen 3 chipset.
- The device will support "5.5G" and satellite connectivity in China.
- It will feature a 50 MP "eagle eye camera" and an "ultra thin" USB Type-C port.
- The battery capacity will range from 5,000 mAh to 5,990 mAh, supporting 66W wired charging.
Honor’s Magic V2 has held the title of the thinnest large-format foldable smartphone since its release in July of last year, with a folded thickness of just 9.9mm. However, Honor is not stopping there. The company has announced on Weibo that the upcoming Magic V3 will set a new standard for slim foldable smartphones.
Magic V3 Teaser and Specifications
Thickness
The teaser reveals that the Magic V3 will be even thinner than its predecessor, the Magic V2. Although Honor has not provided specific details, a tipster on X claims that the Magic V3 will have a folded thickness between 9mm and 9.98mm.
Key Features
The Magic V3 will be powered by the Snapdragon 8 Gen 3 chipset, ensuring top-tier performance. It will support advanced connectivity options, including “5.5G” and satellite connectivity in China. The device is expected to weigh between 220g and 229g.
In terms of battery, the Magic V3 will have a capacity ranging from 5,000 mAh to 5,990 mAh and will support 66W wired charging, providing quick and efficient power replenishment. The phone will also feature a 50 MP “eagle eye camera” and an “ultra-thin” USB Type-C port.
Launch Date
Previous rumors suggested that the Honor Magic V3 would be released in July, and the initiation of the teaser campaign supports this timeline.
Conclusion
The Honor Magic V3 promises to be an even slimmer and more advanced foldable smartphone than its predecessor, setting new benchmarks in the industry. With its cutting-edge specifications and innovative design, it is poised to attract significant attention upon its release.
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